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Diamond Components
Spherical Diamond
Thermal gel heat dissipation, silicon wafer polishing, optical precision polishing, sapphire polishing, metal/electroplated diamond tools manufacturing
W: Particle Size：2 - 60 μm
USD $0 — $2 / carat
per unit
Featured
Abrasives
Monocrystalline Diamond Ball
Grit dressing tools, thermal gel thermal conductive filler
W: 18/20, 20/25, 25/30, 30/35, 35/40, 40/45, customizable special sizes
USD $0 — $2 / carat
per unit
Featured
Abrasives
Agglomerated Diamond
SiC wafer precision grinding, sapphire panel shaping & polishing, optical crystal grinding, micro glass precision processing, ceramic components…
W: Raw fine diamond: 0 – 6 μm; Finished agglomerate: 3 – 60 μm, customized up to 70-130 μm Standard size matching: 0-3μm raw → 10-30μm finished; 1-3μm raw → 20-40μm finished 3-6μm raw → 40-60μm finished; 2-8μm raw → 70-130μm finished
USD $0 — $2 / carat
per unit
Diamond Components
Direct Etching Diamond
Metal bond diamond tools, sintered tools, power module thermal filler (SiC/GaN modules), aerospace high-reliability electronic thermal management
W: D80/D90 series; 12mm, 16/18, 18/20, 20/25 and other sizes
USD $0 — $2 / carat
per unit