Description
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- Particle Size:D80/D90 series; 12mm, 16/18, 18/20, 20/25 and other sizes
- Raw Material:Single crystal diamond with surface roughened by direct etching process
- Core Features:
- Solve weak bonding between diamond and matrix metal
- Excellent static pressure strength, thermal toughness and stability
- Performance 2-3 times higher than traditional industrial diamond
- Rough surface improves interface bonding, reduces thermal resistance
- Application:
Metal bond diamond tools, sintered tools, power module thermal filler (SiC/GaN modules), aerospace high-reliability electronic thermal management
- Delivery Form:Dry powder
- Customizable:Custom particle size, surface etching modification
- Industry:Abrasive tools, semiconductor thermal management, aerospace electronics
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