Description
- Particle Size:2 – 60 μm
- Raw Material:Crushed high-grade single crystal diamond
- Core Features:
Nearly spherical shape, smooth edge without sharp corners; narrow particle size distribution; low internal & surface impurities; good dispersion, strong wear resistance, compatible with all binders
- Application:
Thermal gel heat dissipation, silicon wafer polishing, optical precision polishing, sapphire polishing, metal/electroplated diamond tools manufacturing
- Delivery Form:Dry powder, Slurry / Suspension
- Customizable:Custom particle size grading
- Industry:Semiconductor polishing, optical processing, thermal management, abrasive tools









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