Description
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- Raw Material:0-6μm fine diamond particles bonded with special adhesive
- Core Features:
- Perfect sphericity, no apple/donut irregular shape
- Self-sharpening during grinding, continuously expose new cutting edges
- Stable high grinding efficiency, no blunt abrasion
- Keep workpiece surface strength with smooth polished finish
- Application:
SiC wafer precision grinding, sapphire panel shaping & polishing, optical crystal grinding, micro glass precision processing, ceramic components grinding
- Delivery Form:Dry powder, Slurry / Suspension
- Customizable:Custom agglomerate particle size; Waste superabrasive material agglomeration processing service
- Industry:Semiconductor wafer processing, optical polishing, ceramic precision machining
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