Featured
Diamond Components
HTHP - Spherical Diamond
Thermal gel heat dissipation, silicon wafer polishing, optical precision polishing, sapphire polishing, metal/electroplated diamond tools manufacturing
W: Particle Size：2 - 60 μm
USD $0 — $2 / carat
per unit
Diamond Components
HTHP - Direct Etching Diamond
Metal bond diamond tools, sintered tools, power module thermal filler (SiC/GaN modules), aerospace high-reliability electronic thermal management
W: D80/D90 series; 12mm, 16/18, 18/20, 20/25 and other sizes
USD $0 — $2 / carat
per unit
