Featured
Abrasives
HTHP - Agglomerated Diamond
SiC wafer precision grinding, sapphire panel shaping & polishing, optical crystal grinding, micro glass precision processing, ceramic components…
W: Raw fine diamond: 0 – 6 μm; Finished agglomerate: 3 – 60 μm, customized up to 70-130 μm Standard size matching: 0-3μm raw → 10-30μm finished; 1-3μm raw → 20-40μm finished 3-6μm raw → 40-60μm finished; 2-8μm raw → 70-130μm finished
USD $0 — $2 / carat
per unit
Abrasives
HTHP - Micron Diamond Fine Powder
Metal bond abrasives, ceramic bond abrasives, electroplating tools, composite sheets grinding & polishing
W: D80/D90 series; 12mm, 16/18, 18/20, 20/25 and other sizes
USD $0 — $2 / carat
per unit
